Company Information
Company Profile
Cash Flow Statement
Profit & Loss
Financial Position
Financial Ratio
Industry 制造业
Company Introduction 2005年6月,苏州晶方半导体科技股份有限公司（SSE：603005）成立于苏州，是一家致力于开发与创新新技术，为客户提供可靠的，小型化，高性能和高性价比的半导体封装量产服务商。晶方科技的CMOS影像传感器晶圆级封装技术，彻底改变了封装的世界，使高性能，小型化的手机相机模块成为可能。这一价值已经使之成为有史以来应用最广泛的封装技术，现今已有近50％的影像传感器芯片可使用此技术，大量应用于智能电话，平板电脑，可穿戴电子等各类电子产品。公司及子公司OptizInc.（位于PaloAlto，加州）将持续专注于技术创新。 近十年来，晶方科技已经成为技术开发与创新、提供优质量产服务的领导者。随着公司不断发展壮大，公司1）设立美国子公司OptizInc.，是在影像传感器微型化的增强与分析领域的领导者；2）购买智瑞达资产，是新一代半导体封装技术的创新者。 晶方科技的使命是创新和发展半导体的互连和成像技术，为我们的客户、合作伙伴、员工和股东创造价值。 晶方科技全球员工将近2000人,工程师和科学家大约400人，其中超过50%拥有高等学位。
Main Business 集成电路先进封装技术的开发与服务
Legal Representative 王蔚
Top Executives
董事长：王蔚
董事：张斌,刘文浩,Vage Oganesian
独立董事：鞠伟宏,钱跃竑,刘海燕
Top 5 Shareholder
Shareholder name Nature Holding Date
中新苏州工业园区创业投资有限公司流通A股17.76%30/09/2024
国泰君安证券股份有限公司－国联安中证全指半导体产品与设备交易型开放式指数证券投资基金流通A股1.54%30/09/2024
招商银行股份有限公司－南方中证1000交易型开放式指数证券投资基金流通A股1.15%30/09/2024
香港中央结算有限公司流通A股1.05%30/09/2024
招商银行股份有限公司－华夏中证1000交易型开放式指数证券投资基金流通A股0.64%30/09/2024
Company Secretary 段佳国
Solicitors 北京观韬中茂律师事务所
Auditors 容诚会计师事务所（特殊普通合伙）
Tel No 0512-67730001
Fax No 0512-67730808
Website www.wlcsp.com
Email info@wlcsp.com
Company Address
Register: 江苏省苏州工业园区汀兰巷29号
Office: 江苏省苏州工业园区汀兰巷29号
Listing Date 10/02/2014
Shares Capital
Shares Capital: 652,171,706
Total A Share: 652,171,706
Listed A Share: 652,171,706
Non-tradable A Share: 0
Other Share: 0
Total B Share: 0
Total H Share: 0
EPS(RMB)* ¥ 0.230
DPS(RMB)* ¥ 0.046
NBV Per Share(RMB)* ¥ 6.265
Market Capitalization(RMB) 19.330B
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 : Eligible Stock for SH-HK Northbound trade (For all investors/ For institutional professional investors only)
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 : Eligible Stock for SH-HK Ex-Northbound trade (sell only)
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 : Eligible Stock for SZ-HK Northbound trade (For all investors/ For institutional professional investors only)
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 : Eligible Stock for SZ-HK Ex-Northbound trade (sell only)
* Unadjusted Data
Information provided by: etnet
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