| Industry | 制造业 | ||||||||||||||||||||||||
| Company Introduction | 新恒汇电子股份有限公司是集引线框架、模块封装、晶圆减薄划片与测试为一体的集成电路企业，主持制订了集成电路（卡）封装框架国家标准，产品及生产技术完全自主开发，拥有数十项专利和软件著作权，产品替代进口并实现出口，已通过ISO9001:2015质量管理体系和ISO14001:2015环境管理体系认证，具有安全体系CCEAL5+认证证书以及CQM证书，产品质量位居同行业前列。 公司是高新技术企业，具有行业领先的生产设备和研发环境，建立了高效的生产能力和高水平的工艺技术，以及完善的上下游产业链配套，能够生产接触式、非接触式、双界面；镀金、镀钯金等多个系列数十种规格的IC卡封装框架和模块产品，并能根据用户要求，研制、开发、生产个性化的智能卡产品，我们是中电华大、紫光国微、三星电子、上海复旦微电子、大唐微电子等国内外知名安全芯片设计厂商的重要合作伙伴。产品已销往欧盟、东南亚、俄罗斯、非洲、南美洲等国家和地区，广泛应用于通讯、金融、交通、身份识别、物联网及公共安全等领域。 公司的蚀刻金属引线框架（LeadFrame）以及物联网eSIM封装已经实现量产，广泛替代进口。同时，在万物互联的物联网安全领域占据一定的市场份额，为企业后续发展开拓广阔的道路。 公司致力于自主研发和产品创新，建有集成电路封测与材料工程研究中心，有专业的可靠性和失效分析实验室。公司拥有高水平的研发团队，充满活力且极具创新精神，为新产品的快速研发提供强有力的支持。研发团队对基础材料、关键工艺、未来新产品设计等提供源源不断的技术储备与前期研发，为企业长期发展提供充足动力。 公司以业务与资本双轮驱动，整合国内外产业资源，以制造一流产品与服务，服务全球客户为目标，引领行业技术发展方向，建成国际化的全球IC封装材料领军企业。 | ||||||||||||||||||||||||
| Main Business | 集芯片封装材料的研发、生产、销售与封装测试服务于一体的集成电路企业 | ||||||||||||||||||||||||
| Legal Representative | 任志军 | ||||||||||||||||||||||||
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| Company Secretary | 张建东 | ||||||||||||||||||||||||
| Solicitors | 上海市锦天城律师事务所 | ||||||||||||||||||||||||
| Auditors | 立信会计师事务所（特殊普通合伙） | ||||||||||||||||||||||||
| Tel No | 0533-2221999 | ||||||||||||||||||||||||
| Fax No | 0533-3982701 | ||||||||||||||||||||||||
| Website | www.henghuiic.com | ||||||||||||||||||||||||
| office@henghuiic.com | |||||||||||||||||||||||||
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| Listing Date | 20/06/2025 | ||||||||||||||||||||||||
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| EPS(RMB)* | ¥ 1.040 | ||||||||||||||||||||||||
| DPS(RMB)* | -- | ||||||||||||||||||||||||
| NBV Per Share(RMB)* | ¥ 6.790 | ||||||||||||||||||||||||
| Market Capitalization(RMB) | 1.917B |
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| * | Unadjusted Data |
| Information provided by: etnet | ||
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