Company Information
Company Profile
Cash Flow Statement
Profit & Loss
Financial Position
Financial Ratio
Industry 制造业
Company Introduction 华天科技成立于2003年12月25日，2007年11月20日在深交所成功上市（股票代码：002185）。 主要从事集成电路封装测试业务。作为全球集成电路封测知名企业，华天科技为客户提供封装设计、封装仿真、引线框封装、基板封装、晶圆级封装、晶圆测试及功能测试、 物流配送等一站式服务。凭借先进的技术能力，系统级生产和质量把控，已成为集成电路封测业务首选品牌。
Main Business 半导体集成电路的封装与测试。
Legal Representative 肖胜利
Top Executives
董事长：肖胜利
董事：张玉明1,杨柳,肖智轶,崔卫兵,刘建军
独立董事：石瑛,吕伟,于燮康
Top 5 Shareholder
Shareholder name Nature Holding Date
天水华天电子集团股份有限公司流通A股22.71%30/09/2024
华芯投资管理有限责任公司－国家集成电路产业投资基金二期股份有限公司流通A股3.21%30/09/2024
香港中央结算有限公司流通A股2.18%30/09/2024
中国建设银行股份有限公司－华夏国证半导体芯片交易型开放式指数证券投资基金流通A股1.86%30/09/2024
中国农业银行股份有限公司－中证500交易型开放式指数证券投资基金流通A股1.44%30/09/2024
Company Secretary 常文瑛
Solicitors 北京市竞天公诚律师事务所
Auditors 大信会计师事务所（特殊普通合伙）
Tel No 0938-8631816;0938-8631990
Fax No 0938-8632260
Website www.ht-tech.com
Email Wenying.Chang@ht-tech.com；caiping.yang@ht-tech.com；htcwy2000@163.com
Company Address
Register: 甘肃省天水市秦州区双桥路14号
Office: 甘肃省天水市秦州区赤峪路88号
Listing Date 20/11/2007
Shares Capital
Shares Capital: 3,204,484,648
Total A Share: 3,204,484,648
Listed A Share: 3,203,739,793
Non-tradable A Share: 744,855
Other Share: 0
Total B Share: 0
Total H Share: 0
EPS(RMB)* ¥ 0.071
DPS(RMB)* ¥ 0.022
NBV Per Share(RMB)* ¥ 4.946
Market Capitalization(RMB) 38.733B
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 : Eligible Stock for SH-HK Northbound trade (For all investors/ For institutional professional investors only)
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 : Eligible Stock for SH-HK Ex-Northbound trade (sell only)
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 : Eligible Stock for SZ-HK Northbound trade (For all investors/ For institutional professional investors only)
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 : Eligible Stock for SZ-HK Ex-Northbound trade (sell only)
* Unadjusted Data
Information provided by: etnet
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