Industry | 制造业 | ||||||||||||||||||||||||
Company Introduction | 公司主要从事集成电路的封装和测试业务,为集成电路设计企业提供集成电路封装与测试解决方案,并收取封装和测试服务加工费。公司封装产品主要包括“高密度细间距凸点倒装产品(FC类产品)、系统级封装产品(SiP)、晶圆级封装产品(Bumping及WLP)、扁平无引脚封装产品(QFN/DFN)、微机电系统传感器(MEMS)”5大类别。下游客户主要为集成电路设计企业,产品主要应用于射频前端芯片,AP类SoC芯片,触控芯片、WiFi芯片、蓝牙芯片、MCU等物联网AIOT芯片、电源管理芯片、计算类芯片、工业类和消费类产品等领域。 公司于2017年11月设立,从成立之初即聚焦集成电路封测业务中的先进封装领域,车间洁净等级、生产设备、产线布局、工艺路线、技术研发、业务团队、客户导入均以先进封装业务为导向。报告期内,公司全部产品均为QFN、LGA、BGA、FlipChip、Bumping、WLCSP等中高端先进封装形式,并在系统级封装(SiP)、高密度细间距凸点倒装产品(FC类产品)、大尺寸/细间距扁平无引脚封装产品(QFN/DFN)、Bumping/WLP等先进封装领域具有较为突出的工艺优势和技术先进性。 公司为了保持先进封装技术的先进性和竞争优势,在技术研发和产品开发布局上,一方面注重与先进晶圆工艺制程发展相匹配,另一方面注重以客户和市场需求导向为目标。结合半导体封测领域前沿技术发展趋势,以及物联网、5G、人工智能、大数据等应用领域对集成电路芯片的封测需求,公司陆续完成了倒装和焊线类芯片的系统级混合封装技术、5纳米晶圆倒装技术等技术的开发,并成功实现稳定量产。同时,公司已经掌握了系统级封装电磁屏蔽(EMIShielding)技术、芯片表面金属凸点(Bumping)技术、Fan-in技术,并积极开发Fan-out、2.5D/3D等晶圆级封装技术、高密度系统级封装技术、大尺寸FC-BGA封装技术等,为公司未来业绩可持续发展积累了较为深厚的技术储备。 | ||||||||||||||||||||||||
Main Business | 从事集成电路的封装和测试业务,为集成电路设计企业提供集成电路封装与测试解决方案,并收取封装和测试服务加工费。 | ||||||||||||||||||||||||
Legal Representative | 王顺波 | ||||||||||||||||||||||||
Top Executives |
|
||||||||||||||||||||||||
Top 5 Shareholder |
|
||||||||||||||||||||||||
Company Secretary | 李大林 | ||||||||||||||||||||||||
Solicitors | 上海市锦天城律师事务所 | ||||||||||||||||||||||||
Auditors | 天健会计师事务所(特殊普通合伙) | ||||||||||||||||||||||||
Tel No | 0574-58121888-6786 | ||||||||||||||||||||||||
Fax No | 0574-62089985 | ||||||||||||||||||||||||
Website | www.forehope-elec.com | ||||||||||||||||||||||||
zhengquanbu@forehope-elec.com | |||||||||||||||||||||||||
Company Address |
|
||||||||||||||||||||||||
Listing Date | 16/11/2022 | ||||||||||||||||||||||||
Shares Capital |
|
||||||||||||||||||||||||
EPS(RMB)* | ¥ -0.230 | ||||||||||||||||||||||||
DPS(RMB)* | -- | ||||||||||||||||||||||||
NBV Per Share(RMB)* | ¥ 6.006 | ||||||||||||||||||||||||
Market Capitalization(RMB) | 6.932B |
Only Chinese content is avaliable | |
N
/
N
: Eligible Stock for SH-HK Northbound trade (For all investors/ For institutional professional investors only)
N
: Eligible Stock for SH-HK Ex-Northbound trade (sell only)
|
|
N
/
N
: Eligible Stock for SZ-HK Northbound trade (For all investors/ For institutional professional investors only)
N
: Eligible Stock for SZ-HK Ex-Northbound trade (sell only)
|
|
* | Unadjusted Data |
Information provided by: etnet | ||
Terms and Conditions |
Risk Disclosure: |
The prices of securities may fluctuate, sometimes dramatically. The price of a security may move up or down, and may become valueless. It is as likely that losses will be incurred rather than profit made as a result of buying and selling securities. The information is for reference only, it does not constitute any offer, solicitation, recommendation, comment or any guarantee to the purchase or sale of any investment product or service. Customers should not make any investment decisions based on this information alone. |
Disclaimer: |
This information is provided by ET Net Limited ("ET Net") and/or its third party information providers (the "Sources") and is strictly for reference only. It is not intended to provide any financial or professional advice and any person should not rely upon the same as such. You should obtain relevant and specific professional advice before making any investment decision. Before making an investment decision, you should consider, with the assistance of your professional securities adviser, whether the information is appropriate in light of your particular investment needs, objectives and financial circumstances. ET Net and the Sources endeavor to ensure the accuracy and reliability of the information provided. Notwithstanding the aforesaid, ET Net, the Sources, Nanyang Commercial Bank Limited do not guarantee or make any representation, warranty or undertaking as to the accuracy, reliability, completeness or timeliness of this information, and accept no responsibility or liability whatsoever (whether in tort or contract or otherwise) for any loss or damage howsoever arising from or in reliance upon the whole or any part of such information. |