Company Information
Industry 制造业
Company Introduction 公司致力于集成电路领域关键材料的研发与产业化应用,是境内少数具备12英寸集成电路晶圆制造关键材料研发和量产能力的创新企业之一,主要从事光刻材料和前驱体材料的研发、生产和销售。 公司产品主要应用于先进NAND、DRAM存储芯片与90nm技术节点及以下逻辑芯片生产制造的光刻、薄膜沉积等工艺环节,系集成电路晶圆制造不可或缺的关键材料。报告期内,公司已量产供货产品包括SOC、BARC、i-Line光刻胶、KrF光刻胶等光刻材料以及TEOS等前驱体材料,量产供货款数随着产品验证通过而持续提升。同时,公司持续开发新产品,包括ArF光刻胶、SiARC、TopCoating等光刻材料和硅基、金属基前驱体材料均已进入客户验证流程,ArF光刻胶已通过验证并小规模销售。截至报告期末,公司自产产品在研发、验证以及量供款数累计已超过百款。此外,在境内集成电路供应链安全需求增加背景下,公司依靠对集成电路晶圆制造各类工艺的专业理解与技术积累,引进销售进口光刻材料、前驱体材料、电子特气及其他湿电子化学品等集成电路关键材料,创新性地走出了一条“引进、消化、吸收、再创新”的发展路径。公司客户涵盖了多家中国境内领先的12英寸集成电路晶圆厂,已实现境外同类产品替代,打破12英寸集成电路关键材料国外垄断。
Main Business 光刻材料和前驱体材料的研发、生产和销售。
Legal Representative 易荣坤
Top Executives
董事长:易荣坤
董事:庄超颖,肖楠,王廷通
独立董事:黄兴孪,苏小榕,邹友思
Top 5 Shareholder
Shareholder name Nature Holding Date
易荣坤限售股16.59%17/11/2025
淄博市财金控股集团有限公司限售股3.71%17/11/2025
李湘江限售股3.46%17/11/2025
厦门神剑投资合伙企业(有限合伙)限售股2.85%17/11/2025
苏州厚望新业创业投资合伙企业(有限合伙)限售股2.84%17/11/2025
Company Secretary 陈颖峥
Solicitors 上海市锦天城律师事务所
Auditors 容诚会计师事务所(特殊普通合伙)
Tel No 0592-6208266
Fax No 0592-6207888
Website www.hengkun.com
Email ir@hengkun.com
Company Address
Register: 福建省厦门市海沧区东孚镇山边路389号
Office: 福建省厦门市海沧区东孚镇山边路389号
Listing Date 18/11/2025
Shares Capital
Shares Capital: 449,319,600
Total A Share: 449,319,600
Listed A Share: 50,243,165
Non-tradable A Share: 399,076,435
Other Share: 0
Total B Share: 0
Total H Share: 0
EPS(RMB)* ¥ 0.250
DPS(RMB)* --
NBV Per Share(RMB)* ¥ 3.930
Market Capitalization(RMB) 3.093B
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 : Eligible Stock for SH-HK Northbound trade (For all investors/ For institutional professional investors only)
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 : Eligible Stock for SH-HK Ex-Northbound trade (sell only)
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 : Eligible Stock for SZ-HK Northbound trade (For all investors/ For institutional professional investors only)
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 : Eligible Stock for SZ-HK Ex-Northbound trade (sell only)
* Unadjusted Data
Information provided by: etnet
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