Company Information
Industry 制造业
Company Introduction 合肥晶合集成电路股份有限公司(简称“晶合集成”)成立于2015年5月,由合肥市建设投资控股(集团)有限公司与台湾力晶科技股份有限公司合资建设,位于合肥市新站高新技术产业开发区综合保税区内,是安徽省首家12英寸晶圆代工企业。 晶合集成专注于半导体晶圆生产代工服务,致力于为国内提升自主可控的集成电路制造能力贡献力量,为客户提供150-55纳米不同制程工艺,未来将导入更先进制程技术。截至2022年,公司年营收突破100亿元,实现在液晶面板驱动芯片代工领域市占率全球第一的目标,成为中国大陆第三大晶圆代工企业。2023年5月,公司正式在上海证券交易所科创板挂牌上市,成为安徽省首家成功登陆资本市场的纯晶圆代工企业。 晶合集成以客户需求为导向,结合平板显示、汽车电子、家用电器、工业控制、人工智能、物联网等产业发展趋势,提供面板驱动芯片、微控制器(MCU)、CMOS图像传感器(CIS)、电源管理(PMIC)、人工智能物联网(AIoT)等不同应用领域芯片代工,矢志成为中国最卓越的集成电路专业制造公司之一。
Main Business 从事12英寸晶圆代工业务
Legal Representative 蔡国智
Top Executives
董事长:蔡国智
副董事长:陆勤航
董事:朱才伟,谢明霖,陈小蓓,郭兆志
独立董事:安广实,蔺智挺,陈绍亨
Top 5 Shareholder
Shareholder name Nature Holding Date
合肥市建设投资控股(集团)有限公司限售股23.35%30/09/2024
力晶创新投资控股股份有限公司流通A股20.58%30/09/2024
合肥芯屏产业投资基金(有限合伙)限售股16.39%30/09/2024
美的创新投资有限公司流通A股4.39%30/09/2024
安徽创谷股权投资基金管理有限公司-合肥中安智芯股权投资合伙企业(有限合伙)流通A股1.72%30/09/2024
Company Secretary 朱才伟
Solicitors 北京市金杜律师事务所
Auditors 容诚会计师事务所(特殊普通合伙)
Tel No 0551-62637000转612688
Fax No 0551-62636000
Website www.nexchip.com.cn
Email stock@nexchip.com.cn
Company Address
Register: 安徽省合肥市新站区合肥综合保税区内西淝河路88号
Office: 安徽省合肥市新站区合肥综合保税区内西淝河路88号
Listing Date 05/05/2023
Shares Capital
Shares Capital: 2,006,135,157
Total A Share: 2,006,135,157
Listed A Share: 1,176,731,020
Non-tradable A Share: 829,404,137
Other Share: 0
Total B Share: 0
Total H Share: 0
EPS(RMB)* ¥ 0.120
DPS(RMB)* --
NBV Per Share(RMB)* ¥ 10.672
Market Capitalization(RMB) 28.559B
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 : Eligible Stock for SH-HK Northbound trade (For all investors/ For institutional professional investors only)
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 : Eligible Stock for SH-HK Ex-Northbound trade (sell only)
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 : Eligible Stock for SZ-HK Northbound trade (For all investors/ For institutional professional investors only)
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 : Eligible Stock for SZ-HK Ex-Northbound trade (sell only)
* Unadjusted Data
Information provided by: etnet
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