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| Company Introduction | 盛合晶微是全球领先的集成电路晶圆级先进封测企业,起步于先进的12英寸中段硅片加工,并进一步提供晶圆级封装(WLP)和芯粒多芯片集成封装等全流程的先进封测服务,致力于支持各类高性能芯片,尤其是图形处理器(GPU)、中央处理器(CPU)、人工智能芯片等,通过超越摩尔定律(MorethanMoore)的异构集成方式,实现高算力、高带宽、低功耗等的全面性能提升。 | ||||||||||||||||||||||||
| Main Business | 中段硅片加工、晶圆级封装、芯粒多芯片集成封装等晶圆级先进封测服务 | ||||||||||||||||||||||||
| Legal Representative | 崔东 | ||||||||||||||||||||||||
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| Company Secretary | 周燕 | ||||||||||||||||||||||||
| Solicitors | 上海市锦天城律师事务所 | ||||||||||||||||||||||||
| Auditors | 容诚会计师事务所(特殊普通合伙) | ||||||||||||||||||||||||
| Tel No | 0510-86975899 | ||||||||||||||||||||||||
| Fax No | -- | ||||||||||||||||||||||||
| Website | www.sjsemi.com | ||||||||||||||||||||||||
| IR@sjsemi.com | |||||||||||||||||||||||||
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| Listing Date | 21/04/2026 | ||||||||||||||||||||||||
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| EPS(RMB)* | ¥ 0.570 | ||||||||||||||||||||||||
| DPS(RMB)* | -- | ||||||||||||||||||||||||
| NBV Per Share(RMB)* | ¥ 8.460 | ||||||||||||||||||||||||
| Market Capitalization(RMB) | 0.000B |
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| * | Unadjusted Data |
| Information provided by: etnet | ||
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