Company Information
Industry --
Company Introduction 盛合晶微是全球领先的集成电路晶圆级先进封测企业,起步于先进的12英寸中段硅片加工,并进一步提供晶圆级封装(WLP)和芯粒多芯片集成封装等全流程的先进封测服务,致力于支持各类高性能芯片,尤其是图形处理器(GPU)、中央处理器(CPU)、人工智能芯片等,通过超越摩尔定律(MorethanMoore)的异构集成方式,实现高算力、高带宽、低功耗等的全面性能提升。
Main Business 中段硅片加工、晶圆级封装、芯粒多芯片集成封装等晶圆级先进封测服务
Legal Representative 崔东
Top Executives
董事长:崔东
董事:俞伟,汪灿,李建文,杨刘,李大峣
独立董事:周忠惠,严勇,王国建
Top 5 Shareholder
Shareholder name Nature Holding Date
无锡产发科创基金合伙企业(有限合伙)限售股9.39%20/04/2026
上海玉旷科技合伙企业(有限合伙)限售股5.88%20/04/2026
深圳市远致一号私募股权投资基金合伙企业(有限合伙)限售股5.30%20/04/2026
上海芮嵊信息科技合伙企业(有限合伙)限售股2.45%20/04/2026
苏州元禾厚望长芯贰号创业投资合伙企业(有限合伙)限售股2.28%20/04/2026
Company Secretary 周燕
Solicitors 上海市锦天城律师事务所
Auditors 容诚会计师事务所(特殊普通合伙)
Tel No 0510-86975899
Fax No --
Website www.sjsemi.com
Email IR@sjsemi.com
Company Address
Register: PO Box 309, Ugland House, Grand Cayman KY1-1104, Cayman Islands
Office: 江苏省无锡市江阴市东盛西路9号
Listing Date 21/04/2026
Shares Capital
Shares Capital: 1,862,774,097
Total A Share: 1,862,774,097
Listed A Share: 172,902,643
Non-tradable A Share: 1,689,871,454
Other Share: 0
Total B Share: 0
Total H Share: 0
EPS(RMB)* ¥ 0.570
DPS(RMB)* --
NBV Per Share(RMB)* ¥ 8.460
Market Capitalization(RMB) 0.000B
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 : Eligible Stock for SH-HK Northbound trade (For all investors/ For institutional professional investors only)
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 : Eligible Stock for SH-HK Ex-Northbound trade (sell only)
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 : Eligible Stock for SZ-HK Northbound trade (For all investors/ For institutional professional investors only)
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 : Eligible Stock for SZ-HK Ex-Northbound trade (sell only)
* Unadjusted Data
Information provided by: etnet
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